In-situ Structural Evaluation of Copper Plating Films for Power Saving IC Interconnections by Back Incidence Neutron Reflectometry
Grant-in-Aid for Scientific Research (C)
Basic Section 26050:Material processing and microstructure control-related
Comprehensive Research Organization for Science and Society
Noboru Miyata
From 01 Apr. 2019, To 31 Mar. 2024, Project Closed
中性子反射率法;めっき膜;中性子反射率;電解銅めっき;めっき;その場観察